soic vs sop
The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP, thereby expanding the margin of operating parameters. I read on wiki that SOIC is also called SO: Serial LCD keypad panel,phi_prompt user interface library,SDI-12 USB Adapter.

Network Consists of Further Focused Websites (Channels). This is an even smaller version of SOIC package. site design / logo © 2020 Stack Exchange Inc; user contributions licensed under cc by-sa. Thanks guys! Small outline actually refers to IC packaging standards from at least two different organizations: So besides TI, do other manufactures also have different SOP and SOIC foot prints? Don't forget to check the width when you order them. Memory modules, disk drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics / appliances are suggested uses for TSSOP packaging. A Type II TSSOP has the legs protruding from the length portion of the package. The SOIC is more than 50% longer than the TSSOP. Now with Unlimited Eagle board sizes. This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing. There seems to be a difference to the thickness but other than that looks like it would fit on the same pads. Using the socket allows for the DIP IC to be removed from and inserted into the PCB easily. This case is much smaller with a pitch of only 0.5 mm. Puzzled by SOIC8 vs SOP8. Smaller variants of the standard QFP package include thin QFP (TQFP), very-thin QFP (VQFP) and low-profile QFP (LQFP) packages. For a better experience, please enable JavaScript in your browser before proceeding.

Similar to SOIC, SOP family has a smaller form factor, with pin spacing less than 1.27mm. There are slight differences, but basically they are the same. They are generally available in the same pin-outs as their counterpart DIP ICs. SOP SOIC Is there any important differences between these two packages th... Stack Exchange Network Stack Exchange network consists of 176 Q&A communities including Stack Overflow , the largest, most trusted online community for developers to learn, share their knowledge, and build their careers. Electrical Engineering Stack Exchange is a question and answer site for electronics and electrical engineering professionals, students, and enthusiasts. All IC assembly processes remain the same as with standard SOPs.

Difference between wire wound and ceramic chip inductors, Clip type for in-system programming (SOIC8 vs DIP8), Altium: What stands for 'N' , 'M' and 'L' as a suffix for SOIC packages. TSSOP is Thin SSOP. It says SO16 and in details Small outline package. The most common pin counts are four, six, eight, fourteen, eighteen, twenty, twenty-eight and forty pins. Oct 20, 2005 #2 in my experience, so-8 is just shorthand for soic-8 but it would be best to compare your pad layout, whichever you decide on to the pad layout the manuf. There are many types of IC packages, each having unique dimensions, mounting types and/or pin counts. crutschow. Next to the narrow SOIC package (commonly represented as SOx_N or SOICx_N, where x is the number of pins), there's also the wide (or sometimes called extended) version.


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